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1. product pro?le 1.1 general description passivated sensitive gate triac in a sot223 surface-mountable plastic package 1.2 features 1.3 applications 1.4 quick reference data 2. pinning information OT406 four-quadrant triac, enhanced noise immunity rev. 01 19 may 2008 product data sheet n sensitive gate n gate triggering in four quadrants n direct interfacing to logic level ics n direct interfacing to low power gate drive circuits n enhanced immunity to voltage transients and noise n blocking voltage to 600 v n home appliances n low power motor control n low power ac fan speed controllers n low power loads in industrial process control n v drm 600 v n i gt 3ma n i tsm 12.5 a (t = 20 ms) n i gt 5 ma (t2 - g+) n i t(rms) 1a table 1. pinning pin description simpli?ed outline graphic symbol 1 main terminal 1 (t1) sot223 2 main terminal 2 (t2) 3 gate (g) 4 mounting base; main terminal 2 (t2) 13 2 4 sym051 t1 g t2
OT406_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 19 may 2008 2 of 13 nxp semiconductors OT406 four-quadrant triac, enhanced noise immunity 3. ordering information 4. limiting values table 2. ordering information type number package name description version OT406 sc-73 plastic surface-mounted package with increased heatsink; 4 leads sot223 table 3. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v drm repetitive peak off-state voltage - 600 v v rrm repetitive peak reverse voltage - 600 v i t(rms) rms on-state current full sine wave; t sp 103 c; see figure 4 and 5 -1a i tsm non-repetitive peak on-state current full sine wave; t j =25 c prior to surge; see figure 2 and 3 t = 20 ms - 12.5 a t = 16.7 ms - 13.8 a i 2 ti 2 t for fusing t p = 10 ms - 1.28 a 2 s di t /dt rate of rise of on-state current i tm = 1 a; i g = 20 ma; di g /dt = 0.2 a/ m s t2+ g+ - 50 a/ m s t2+ g - -50a/ m s t2 - g - -50a/ m s t2 - g+ - 10 a/ m s i gm peak gate current - 1 a p gm peak gate power - 2 w p g(av) average gate power over any 20 ms period - 0.1 w t stg storage temperature - 40 +150 c t j junction temperature - 125 c
OT406_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 19 may 2008 3 of 13 nxp semiconductors OT406 four-quadrant triac, enhanced noise immunity a = conduction angle fig 1. total power dissipation as a function of rms on-state current; maximum values f = 50 hz fig 2. non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum values 003aac259 0.0 0.4 0.8 1.2 1.6 2.0 0 0.2 0.4 0.6 0.8 1 1.2 i t(rms) (a) p tot (w) a = 180 120 90 60 30 conduction angle (degrees) form factor a 30 60 90 120 180 4 2.8 2.2 1.9 1.57 a 003aac260 0 4 8 12 16 1 10 10 2 10 3 number of cycles i tsm (a) i tsm t i t t j(init) = 25 c max 1/f
OT406_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 19 may 2008 4 of 13 nxp semiconductors OT406 four-quadrant triac, enhanced noise immunity t p 20 ms (1) di t /dt limit (2) t2 - g+ quadrant limit fig 3. non-repetitive peak on-state current as a function of pulse width; maximum values f = 50 hz t sp = 103 c fig 4. rms on-state current as a function of surge duration; maximum values fig 5. rms on-state current as a function of solder point temperature; maximum values 003aac262 1 10 10 2 10 3 10 -5 10 -4 10 -3 10 -2 10 -1 t p (s) i tsm (a) (1) (2) i tsm t i t t j(init) = 25 c max t p 003aac269 0 2 4 6 8 10 -2 10 -1 1 10 surge duration (s) i t(rms) (a) 003aac270 0 0.4 0.8 1.2 -50 0 50 100 150 t sp ( c) i t(rms) (a)
OT406_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 19 may 2008 5 of 13 nxp semiconductors OT406 four-quadrant triac, enhanced noise immunity 5. thermal characteristics table 4. thermal characteristics symbol parameter conditions min typ max unit r th(j-sp) thermal resistance from junction to solder point full cycle; see figure 6 --15k/w r th(j-a) thermal resistance from junction to ambient full cycle for minimum footprint see figure 13 - 156 - k/w for pad area see figure 14 - 70 - k/w fig 6. transient thermal impedance from junction to solder point as a function of pulse width 003aac210 10 -2 10 -1 1 10 10 2 10 -5 10 -4 10 -3 10 -2 1 10 t p (s) z th(j-sp) (k/w) t p p t 10 -1
OT406_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 19 may 2008 6 of 13 nxp semiconductors OT406 four-quadrant triac, enhanced noise immunity 6. static characteristics table 5. static characteristics t j =25 c unless otherwise speci?ed. symbol parameter conditions min typ max unit i gt gate trigger current v d = 12 v; i t = 0.1 a; see figure 8 t2+ g+ - - 3 ma t2+ g - --3ma t2 - g - --3ma t2 - g+ - - 5 ma i l latching current v d = 12 v; i g = 0.1 a; see figure 10 t2+ g+ - - 7 ma t2+ g - - - 20 ma t2 - g - --7ma t2 - g+ - - 7 ma i h holding current v d = 12 v; i g = 0.1 a; see figure 11 --7ma v t on-state voltage i t = 1 a; see figure 9 - 1.3 1.6 v v gt gate trigger voltage v d = 12 v; i t = 0.1 a; see figure 7 - - 1.3 v v d =v drm ; i t = 0.1 a; t j = 125 c 0.2 - - v i d off-state current v d =v drm(max) ; t j = 125 c - - 0.5 ma
OT406_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 19 may 2008 7 of 13 nxp semiconductors OT406 four-quadrant triac, enhanced noise immunity 7. dynamic characteristics table 6. dynamic characteristics symbol parameter conditions min typ max unit dv d /dt rate of rise of off-state voltage v dm = 0.67v drm(max) ; t j = 110 c; exponential waveform; gate open circuit 10 - - v/ m s dv com /dt rate of change of commutating voltage v dm = 400 v; t j = 110 c; i tm = 1 a; di com /dt = 0.44 a/ms 0.5 - - v/ m s (1) t2+ g+ (2) t2+ g - (3) t2 - g - (4) t2 - g+ fig 7. normalized gate trigger voltage as a function of junction temperature fig 8. normalized gate trigger current as a function of junction temperature t j ( c) -5 0 150 100 050 003aaa209 0.8 0.4 1.2 1.6 0 v gt(25 c) v gt t j ( c) - 50 150 100 050 003aaa205 2 1 3 4 0 i gt(25 c) i gt (1) (2) (3) (4)
OT406_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 19 may 2008 8 of 13 nxp semiconductors OT406 four-quadrant triac, enhanced noise immunity v o = 1.254 v; r s = 0.31 w (1) t j = 125 c; typical values (2) t j = 125 c; maximum values (3) t j = 25 c; maximum values fig 9. on-state current as a function of on-state voltage fig 10. normalized latching current as a function of junction temperature fig 11. normalized holding current as a function of junction temperature 003aac258 0 0.4 0.8 1.2 1.6 2 0 0.4 0.8 1.2 1.6 2 v t (v) i t (a) (1) (2) (3) t j ( c) - 50 150 100 050 003aaa203 1 2 3 0 i l i l(25 c) t j ( c) - 50 150 100 050 003aaa204 1 2 3 0 i h(25 c) i h
OT406_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 19 may 2008 9 of 13 nxp semiconductors OT406 four-quadrant triac, enhanced noise immunity 8. package outline fig 12. package outline sot223 (sc-73) unit a 1 b p cd e e 1 h e l p qy w v references outline version european projection issue date iec jedec jeita mm 0.10 0.01 1.8 1.5 0.80 0.60 b 1 3.1 2.9 0.32 0.22 6.7 6.3 3.7 3.3 2.3 e 4.6 7.3 6.7 1.1 0.7 0.95 0.85 0.1 0.1 0.2 dimensions (mm are the original dimensions) sot223 sc-73 04-11-10 06-03-16 w m b p d b 1 e 1 e a a 1 l p q detail x h e e v m a a b b c y 0 2 4 mm scale a x 13 2 4 plastic surface-mounted package with increased heatsink; 4 leads sot223
OT406_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 19 may 2008 10 of 13 nxp semiconductors OT406 four-quadrant triac, enhanced noise immunity 9. mounting 9.1 mounting instructions 9.2 printed-circuit board all dimensions are in mm fig 13. minimum footprint sot223 001aab508 3.8 min 1.5 min 1.5 min (3 ) 2.3 4.6 6.3 1.5 min all dimensions are in mm printed-circuit board: fr4 epoxy glass (1.6 mm thick), copper laminate (35 m m thick) fig 14. printed-circuit board pad area sot223 001aab509 7 4.6 15 36 9 10 18 4.5 60 50
OT406_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 19 may 2008 11 of 13 nxp semiconductors OT406 four-quadrant triac, enhanced noise immunity 10. revision history table 7. revision history document id release date data sheet status change notice supersedes OT406_1 20080519 product data sheet - -
OT406_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 19 may 2008 12 of 13 nxp semiconductors OT406 four-quadrant triac, enhanced noise immunity 11. legal information 11.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term short data sheet is explained in section de?nitions. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple dev ices. the latest product status information is available on the internet at url http://www .nxp .com . 11.2 de?nitions draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modi?cations or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local nxp semiconductors sales of?ce. in case of any inconsistency or con?ict with the short data sheet, the full data sheet shall prevail. 11.3 disclaimers general information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes nxp semiconductors reserves the right to make changes to information published in this document, including without limitation speci?cations and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. applications applications that are described herein for any of these products are for illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. limiting values stress above one or more limiting values (as de?ned in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale nxp semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www .nxp .com/pro? le/ter ms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or con?ict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. quick reference data the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 11.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. 12. contact information for more information, please visit: http://www .nxp.com for sales of?ce addresses, please send an email to: salesad dresses@nxp.com document status [1] [2] product status [3] de?nition objective [short] data sheet development this document contains data from the objective speci?cation for product development. preliminary [short] data sheet quali?cation this document contains data from the preliminary speci?cation. product [short] data sheet production this document contains the product speci?cation.
nxp semiconductors OT406 four-quadrant triac, enhanced noise immunity ? nxp b.v. 2008. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com date of release: 19 may 2008 document identifier: OT406_1 please be aware that important notices concerning this document and the product(s) described herein, have been included in section legal information. 13. contents 1 product pro?le . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description. . . . . . . . . . . . . . . . . . . . . . 1 1.2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 quick reference data. . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 1 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 thermal characteristics. . . . . . . . . . . . . . . . . . . 5 6 static characteristics. . . . . . . . . . . . . . . . . . . . . 6 7 dynamic characteristics . . . . . . . . . . . . . . . . . . 7 8 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 9 mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 9.1 mounting instructions . . . . . . . . . . . . . . . . . . . 10 9.2 printed-circuit board . . . . . . . . . . . . . . . . . . . . 10 10 revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 11 legal information. . . . . . . . . . . . . . . . . . . . . . . 12 11.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 12 11.2 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 11.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 11.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 12 contact information. . . . . . . . . . . . . . . . . . . . . 12 13 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

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